Technical Introduction: "Sealing Resin Leakage Prevention, Dam Technology"
Introducing technology to prevent resin leakage! It is possible to prevent resin from leaking.
At Sato-Sen Co., Ltd., we can permanently fill epoxy holes to prevent resin from leaking to the backside through the via during resin sealing. Additionally, if you want to perform solder suction through the via while preventing resin sealing leakage, it is possible to create a tent over the via using film solder resist or copper foil. 【Features】 - Completely prevents leakage of sealing resin for chip vias - Capable of forming a dam to block resin sealing after component mounting - Dam formation technology suitable for BGA and flip chip mounting Please contact us for more details.
- Company：サトーセン
- Price：Other
